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125-1000 MHz Frequency Synthesizer
The MC12181 is a monolithic bipolar synthesizer integrating a high performance prescaler, programmable divider, phase/frequency detector, charge pump, and reference oscillator/buffer functions. The device is capable of synthesizing a signal which is 25 to 40 times the input reference signal. The device has a 4-bit parallel interface to set the proper total multiplication which can range from 25 to 40. When combined with an external passive loop filter and VCO, the MC12181 serves as a complete PLL subsystem.
MC12181
125 - 1000 MHZ FREQUENCY SYNTHESIZER
SEMICONDUCTOR TECHNICAL DATA
* * * * * * * * * *
2.7 to 5.5 V Operation Low power supply current of 4.25 mA typical On chip reference oscillator/buffer supporting wide frequency operating range from 5 to 25 MHz 4-bit parallel interface for programming divider (N = 25 .... 40) Wide 125 - 1000 MHz frequency of operation Digital phase/frequency detector with linear transfer function Balanced Charge Pump Output Space efficient 16 lead SOIC package Operating Temperature Range of -40 to 85C > 1000 V ESD Protection (I/O to Ground, I/O to VCC)
D SUFFIX PLASTIC PACKAGE CASE 751B (SO-16)
16 1
The device is suitable for applications where a fixed local oscillator (LO) needs to be synthesized or where a limited number of LO frequencies need to be generated. The device also has auxiliary open emitter outputs (Pout and Rout) for observing the inputs to the phase detector for verification purposes. In normal use the pins should be left open. The Reset input is normally LOW. When this input is placed in the HIGH state the reference prescaler is reset and the charge pump output (Do) is placed in the OFF state. The 4-bit programming interface maps into divider states ranging from 25 to 40. A is the LSB and D is the MSB. The data inputs (A,B,C, and D) are CMOS compatible and have pull-up resistors. The inputs can be tied directly to Vcc or Ground for programming or can be interfaced to an external data latch/register. Table 1 below has a mapping of the programming states. Table 1. Programming States
D L L L L L L L L H H H H H H H H C L L L L H H H H L L L L H H H H B L L H H L L H H L L H H L L H H A L H L H L H L H L H L H L H L H Divider 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
PIN CONNECTIONS
OSCin 1 OSCout 2 VP 3 VCC 4 Do 5 GND 6 Fin 7 Fin 8 (Top View)
16 A 15 B 14 C 13 D 12 Pout 11 Reset 10 Rout 9 GND
ORDERING INFORMATION
Device MC12181D Operating Temperature Range TA = -40 to +85C Package SO-16
(c) Motorola, Inc. 1997
Rev 2
MC12181
Figure 1. MC12181 Programmable Synthesizer
A B C D
DECODE LOGIC Fin Fin Reset PHASE/FREQ DETECTOR OSCin OSCout CHARGE PUMP
DIVIDE BY 8 PRESCALER
PROGRAMMABLE DIVIDER (25 - 40)
DIVIDE BY 2
Pout
Do
CRYSTAL OSCILLATOR/BUFFER
DIVIDE BY 8 PRESCALER
Rout
PIN NAMES
Pin No. 1 Pin OSCin Function An external parallel resonant, fundamental crystal is connected between OSCin and OSCout to form an internal reference crystal oscillator. External capacitors C1 and C2 are required to set the proper crystal load capacitance and oscillator frequency (Figure 2). For an external reference oscillator, a signal is ac-coupled into the OSCin pin. In either mode a 50 k resistor MUST be connected between OSCin and OSCout. Oscillator output, for use with an external crystal as shown in Figure 2. Positive power supply for charge pump. VP MUST be greater than or equal to VCC. Bypassing should be placed as close as possible to this pin and be connected directly to the ground plane. Positive power supply. Bypassing should be placed as close as possible to this pin and be connected directly to the ground plane. Single ended phase/frequency detector output. Three-state current sink/source output for use as a loop error signal when combined with an external low pass filter. The phase/frequency detector is characterized by a linear transfer function. Ground. This pin should be directly tied to the ground plane. Prescaler input - The VCO signal is ac-coupled into the Fin Pin. Complementary prescaler input - This pin should be capacitively coupled to ground. Ground. This pin should be directly tied to the ground plane. Open emitter test point used to verify proper operation of the reference divider chain. In normal operation this pin should be left OPEN. Test pin used to clear the prescalers (Reset = H). When the Reset is in the HIGH state, the charge pump output is disabled. The Reset input has an internal pulldown. In normal operation it can be left open or tied to ground. Open emitter test point used to verify proper operation of the programmable divider chain. The output is a divide-by-2 version of the programmable input to the phase/frequency detector. In normal operation this pin should be left OPEN. Digital control inputs for setting the value of the programmable divider. A is the LSB and D is the MSB. In normal operation these pins can be tied to VCC and/or ground to program a fixed divide or they can be driven by a CMOS logic level when used in a programmable mode. There is an internal pull-up resistor to VCC on each input.
2 3 4 5
OSCout VP VCC Do
6 7 8 9 10 11 12
GND Fin Fin GND Rout Reset Pout
13 14 15 16
D C B A
2
MOTOROLA RF/IF DEVICE DATA
MC12181
Figure 2. Typical Applications Example
R1 is 50 k (Nominal) C1/C2 depend on crystal selected
1 C1 C2 R1 2
OSCin OSCout VP VCC Do GND Fin Fin
A 16 B 15 C 14 D 13 Pout 12 Reset 11 Rout 10 GND 9 NC NC
VP VCC Passive Filter
0.1 F 0.1 F
3 100 pF 4 100 pF 5 6 1000 pF
CMOS Logic Levels or VCC and/or GND
VCO 1000 pF
7 8
Figure 3. Typical Passive Loop Filter Topology
RX Do RO CO CA CX VCO Input
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Range Maximum Supply Range Maximum Charge Pump Voltage Temperature Ambient Storage Temperature Maximum Input Signal (Any Pin) Symbol VCC VCCmax VPmax TA TSTG Vinmax Min 2.7 - - -40 -65 - Max 5.5 -6.0 VCC to +6.0 85 150 VCC+0.5 V Unit VDC VDC VDC C C VDC
MOTOROLA RF/IF DEVICE DATA
3
MC12181
ELECTRICAL CHARACTERISTICS (VCC = 2.7 to 5.5 V; VP = VCC to 6.0 V; TA = -40 to +85C, unless otherwise noted.)
Characteristic Supply Current for VCC Supply Current for VP Input Frequency Range RF Input Frequency Range Fin Input Sensitivity OSCin Input Sensitivity Output Source Current (Do) Symbol ICC IP OSCin Fin Vin VOSC IOH Min - - 5 125 100 500 -2.8 -2.4 Output Sink Current (Do) IOL 2.0 1.6 Output Leakage Current (Do) Charge Pump Operating Volt Input HIGH Voltage Input LOW Voltage Input HIGH Current Reset, A, B, C, D Reset, A, B, C, D A, B, C, D Reset Input LOW Current A, B, C, D Reset Output Amplitude (Pout, Rout) Vout IIL IOZ VDo VIH VIL IIH - 0.5 0.7 VCC - - - -100 -1 250 Typ 4.0 0.25 - - - - -2.2 -2.0 2.4 2.0 0.5 - - - - - - - 400 Max 5.5 0.5 25 1000 1000 2200 -2.0 -1.6 2.8 2.4 10 VP-0.5 - 0.3 VCC +1 +100 - +1 - mVpp Note 7 A nA V V V A mA Unit mA mA MHz MHz mVpp mVpp mA Condition Note 1 Note 1 Note 2 Note 3 Note 4 Note 4 Note 5 Note 6 Note 5 Note 6 VCC=5.5; VP = 6.0 V; VDo=0.5 to 5.5 V
NOTES: 1. VCC and VP = 5.5 V; Fin = 1.0 GHz; OSCin = 25 MHz; Do open. 2. Assumes C1 and C2 (Figure 2) limited to 30 pF each including stray capacitance in crystal mode, ac coupled input for external reference mode. 3. AC coupling, Fin measured with a 1000pF capacitor. 4. Signal ac coupling in input. 5. VCC = 5.5 V; VP = 6.0 V; VDO = 3.0 V. 6. VP = VCC = 3.0 V; VDO = 1.5 V. 7. Minimum resistor value of 25 k to ground.
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MOTOROLA RF/IF DEVICE DATA
MC12181
APPLICATIONS INFORMATION
The MC12181 is intended for applications where a fixed LO, or a limited number of local oscillator frequencies is required to be synthesized. The device acts as a x25 - 40 PLL. The 4-bit parallel interface allows 1 of 16 divide ratios to be selected. Internally there are fixed divide by 8 prescalers in the reference and programmable paths of the PLL. The MC12181 operates from 125 MHz to 1000 MHz which makes the part ideal for FCC Title 47; Part 15 applications in the 260 MHz to 470 MHz band and the 902 to 928 MHz Band. Figure 4 shows a typical block diagram of the application. Figure 4. Typical Block Diagram of Complete PLL
External Ref 10.0MHz /8 MC12181 PLL /Freq Det Charge Pump Loop Filter VCO 250-400 MHz OSCout OSCin To Phase/ Frequency Detector
minimizing EMI and switching noise which can be generated by rail-to-rail CMOS outputs. The OSCout output should not be used to drive other circuitry. The oscillator buffer in the MC12181 is a single stage, high speed, differential input/output amplifier; it may be considered to be a form of the Pierce oscillator. A simplified circuit diagram is seen in Figure 5. Figure 5. Simplified Crystal Oscillator/Buffer Circuit
VCC
/N 25-40
Bias Source /8
As can be seen from the block diagram, with the addition of a VCO, a loop filter, and either an external oscillator or crystal, a complete PLL sub-system can be realized. Since most of the PLL functions are integrated into the 12181, the users focus is on the loop filter design and the crystal reference oscillator circuit. Crystal Oscillator Design The PLL is used to transfer the high stability characteristic of a low frequency reference source to the high frequency VCO within the PLL loop. To facilitate this, the device contains an input circuit which can be configured as a crystal oscillator or a buffer for accepting an external signal source. In the external reference mode, the reference source is ac-coupling into the OSCin input pin. The level of this signal should be between 500 - 2200 mVp-p. An external low noise reference should be used when it is desired to obtain the best close-in phase noise performance for the PLL. In addition the input reference amplitude should be close to the upper amplitude specification. This maximizes the slew rate of the input signal as it switches against the internal voltage reference. In the crystal mode, an external parallel-resonant fundamental mode crystal should be connected between the OSCin and OSCout pins. This crystal must be between 5 and 25 MHz. External capacitors C1 and C2, as shown in Figure 2, are required to set the proper crystal load capacitance and oscillator frequency. The values of the capacitors are dependent on the crystal choosen and the input capacitance of the device as well as stray board capacitance. Since the MC12181 is realized with an all-bipolar ECL style design, the internal oscillator circuitry is different from more traditional CMOS oscillator designs which realize the crystal oscillator with a modified inverter topology. These CMOS designs typically excite the crystal with a rail-to-rail signal which may overdrive the crystal resulting in damage or unstable operation. The MC12181 design does not exhibit this phenomena because the swing out of the OSCout pin is less than 600 mVp-p. This has the added advantage of
OSCin drives the base of one input of an NPN transistor differential pair. The non-inverting input of the differential pair is internally biased. OSCout is the inverted input signal and is buffered by an emitter follower with a 70 A pull-down current and has a voltage swing of about 600mVp-p. Open loop output impedance is approximately 425 . The opposite side of the differential amplifier output is used internally to drive another buffer stage which drives the phase/frequency detector. With the 50 k feedback resistor in place, OSCin and OSCout are biased to approximately 1.1 V below VCC. The amplifier has a voltage gain of about 15dB and a bandwidth in excess of 150 MHz. Adherence to good RF design and layout techniques, including power supply pin decoupling, is strongly recommended. A typical crystal oscillator application is shown in Figure 2. The crystal and the feedback resistor are connected directly between OSCin and OSCout, while the loading capacitors, C1 and C2, are connected between OSCin and ground, and OSCout and ground respectively. It is important to understand that as far as the crystal is concerned, the two loading capacitors are in series (albeit through ground). So when the crystal specification defines a specific loading capacitance, this refers to the total external (to the crystal) capacitance seen across its two pins. This capacitance consists of the capacitance contributed by the amplifier (IC and packaging), layout capacitance, and the series combination of the two loading capacitors. This is illustrated in the equation below: CI
+ CAMP ) CSTRAY ) C1 ) C2 C1 C2
Provided the crystal and associated components are located immediately next to the IC, thus minimizing the stray capacitance, the combined value of CAMP and CSTRAY is approximately 5pF. Note that the location of the OSCin and OSCout pins at the end of the package, facilitates placing the crystal, resistor and the C1 and C2 capacitors very close to the device. Usually, one of the capacitors is in parallel with an adjustable capacitor used to trim the frequency of oscillation. 5
MOTOROLA RF/IF DEVICE DATA
MC12181
It is important that the total external (to the IC) capacitance seen by either OSCin or OSCout, be no greater than 30pF. In operation, the crystal oscillator will start up with the application of power. If the crystal is in a can that is not grounded it is often possible to monitor the frequency of oscillation by connecting an oscilloscope probe to the can; this technique minimizes any disturbance to the circuit. If this is not possible, a high impedance, low capacitance, FET probe can be connected to either OSCin or OSCout. Signals typically seen at those points will be very nearly sinusoidal with amplitudes of roughly 300-600mVp-p. Some distortion is inevitable and has little bearing on the accuracy of the signal going to the phase detector. Loop Filter Design Because the device is designed for a non-frequency agile synthesizer (i.e., how fast it tunes is not critical) the loop filter design is very straight forward. The current output of the charge pump allows the loop filter to be realized without the need of any active components. The preferred topology for the filter is illustrated in Figure 6. Figure 6. Loop Filter
Xtl Osc /8 Ph/Frq Det Chrg Pump Kp /25-40 N /8 Ro Co
VCO Rx Kv Ca Cx
MC12181
The Ro/Co components realize the primary loop filter. Ca is added to the loop filter to provide for reference sideband suppression. If additional suppression is needed, the Rx/Cx realizes an additional filter. In most applications, this will not be necessary. If all components are used, this results in a 4th order PLL, which makes analysis difficult. To simplify this, the loop design will be treated as a 2nd order loop (Ro/Co) and additional guidelines are provided to minimize the influence of the other components. If more rigorous analysis is needed, mathematical/system simulation tools should be used.
Component Ca Rx Cx Guideline
2) Optimum loop bandwidth for best phase noise performance 3) Minimum loop bandwidth for greatest reference sideband suppression Usually a compromise is struck between these 3 cases, however, for a fixed frequency application, minimizing the tuning speed is not a critical parameter. To specify the loop bandwidth for optimal phase noise performance, an understanding of the sources of phase noise in the system and the effect of the loop filter on them is required. There are 3 major sources of phase noise in the phase-locked loop - the crystal reference, the VCO, and the loop contribution. The loop filter acts as a low-pass filter to the crystal reference and the loop contribution. The loop filter acts as a high-pass filter to the VCO with an in-band gain equal to unity. The loop contribution includes the PLL IC, as well as noise in the system; supply noise, switching noise, etc. For this example, a loop contribution of 15dB has been selected, which corresponds to data in Figure NO TAG. The crystal reference and the VCO are characterized as high-order 1/f noise sources. Graphical analysis is used to determine the optimum loop bandwidth. It is necessary to have noise plots from the manufacturers of both devices. This method provides a straightforward approximation suitable for quickly estimating the optimal bandwidth. The loop contribution is characterized as white-noise or low-order 1/f noise given in the form of a noise factor which combines all the noise effects into a single value. The phase noise of the Crystal Reference is increased by the noise factor of the PLL IC and related circuitry. It is further increased by the total divide-by-N ratio of the loop. This is illustrated in Figure 7. The point at which the VCO phase noise crosses the amplified phase noise of the Crystal Reference is the point of the optimum loop bandwidth. In the example of Figure 7, the optimum bandwidth is approximately 15 KHz. Figure 7. Graphical Analysis of Optimum Bandwidth
Closed Loop Response -60 -70 -80 VCO -90 dB -100 -110 -120 -130 -140 -150 10 100 1k Hz 10k 100k 1M Crystal Reference
15dB NF of the Noise Contribution from Loop
Optimum Bandwidth
<0.1 x Co >10 x Ro <0.1 x Co
20*log(Nt)
The focus of the design effort is to determine what the loop's natural frequency, o, should be. This is determined by Ro, Co, Kp, Kv, and Nt. Because Kp, Kv, and Nt are given, it is only necessary to calculate values for Ro and Co. There are 3 considerations in selecting the loop bandwidth: 1) Maximum loop bandwidth for minimum tuning speed
6
MOTOROLA RF/IF DEVICE DATA
MC12181
Figure 8. Closed Loop Frequency Response for = 1
Natural Frequency 10 3dB Bandwidth 0 -10 -20 dB -30 -40 -50 -60 0.1 1.0 10 Hz 100 1.0 k
Technically, Kv and Kp should be expressed in Radian units [Kv (RAD/V), Kp (A/RAD)]. Since the component design equation contains the Kv x Kp term. the 2 cancels and the values can be epressed as above. Figure 9. Design Equations for the 2nd Order System In summary, follow the steps given below: Step 1: Plot the phase noise of crystal reference and the VCO on the same graph. Step 2: Increase the phase noise of the crystal reference by the noise contribution of the loop. Step 3: Convert the divide-by-N to dB (20log 8 x N) and increase the phase noise of the crystal reference by that amount. Step 4: The point at which the VCO phase noise crosses the amplified phase noise of the Crystal Reference is the point of the optimum loop bandwidth. This is approximately 15 kHz in Figure 7. Step 5: Correlate this loop bandwidth to the loop natural frequency per Figure 8. In this case the 3.0 dB bandwidth for a damping coefficient of 1 is 2.5 times the loop's natural frequency. The relationship between the 3.0 dB loop bandwidth and the loop's "natural" frequency will vary for different values of . Making use of the equations defined in Figure 9, a math tool or spread sheet is useful to select the values for Ro and Co. Appendix: Derivation of Loop Filter Transfer Function The purpose of the loop filter is to convert the current from the phase detector to a tuning voltage for the VCO. The total transfer function is derived in two steps. Step 1 is to find the voltage generated by the impedance of the loop filter. Step 2 is to find the transfer function from the input of the loop filter to its output. The "voltage" times the "transfer function" is the overall transfer function of the loop filter. To use these equations in determining the overall transfer function of a PLL multiply the filter's impedance by the gain constant of the phase detector then multiply that by the filter's transfer function (Figure 10 contains the transfer function equations for 2nd, 3rd and 4th order PLL filters.)
To simplify analysis further a damping factor of 1 will be selected. The normalized closed loop response is illustrated in Figure 8 where the loop bandwidth is 2.5 times the loop natural frequency (the loop natural frequency is the frequency at which the loop would oscillate if it were unstable). Therefore the optimum loop bandwidth is 15 kHz/2.5 or 6.0 kHz (37.7 krads) with a damping coefficient, 1. T(s) is the transfer function of the loop filter.
T(s)
+ + +
RoCos
NCo K pK v
s2
) RoCos ) 1
)1
+
wo s
2z
2 w o2 s
1
)
)1
wo s
2z
)1
NCo KpKv
wo2
2z wo
1
wo + z+
Kp Kv NCo

Co
+ +
KpKv Nwo2 2z
RoCo
woRoCo
2
Ro
woCo
where Nt = Total PLL Divide Ratio -- 8xN where (N = 25...40) Kv = VCO Gain -- Hz/V Kp = Phase Detector/Charge Pump Gain -- A = ( |IOH| + |IOL| ) / 2
MOTOROLA RF/IF DEVICE DATA
7
MC12181
Figure 10. Overall Transfer Function of the PLL For the 2nd Order PLL:
Vp Ro Co Vt
ZLF(s) TLF(s)
+ RoCCooss) 1
Vt + Vp(s) + 1 , (s) Vp(s)
+ Kp(s)ZLF(s)
For the 3rd Order PLL:
Vp Ro Co Ca
Vt
ZLF(s)
o) + C R CRso2C)s(C 1) C )s ooa o a Vt + Vp(s) + 1 , (s)
Vt
TLF(s)
Vp(s)
+ Kp(s)ZLF(s)
For the 4th Order PLL:
Vp Ro Co Ca Rx Cx
ZLF(s)
C 1) xx + C R C R C s3 ) [ (C ) (Ro)RosC)) C(RRC(Cs ) 1) ) ] s2 ) (C ) C ) C )s ooaxx o Ca x x o o x ) Ca o a x Vt + Vp(s) + (RxCx1s ) 1) (s) , Vp(s)
TLF(s)
+ Kp(s)ZLF(s)
Figure 11. Typical Charge Pump Current versus Temperature (VCC = 5.5 V; VP = 6.0 V)
FIGURES 11 THRU 17 COULD NOT BE PROCESSED FOR PDF FORMAT. FOR COMPLETE DOCUMENT WITH ALL IMAGES, PLEASE ORDER FROM MFAX OR LITERATURE DISTRIBUTION CENTER.
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MOTOROLA RF/IF DEVICE DATA
MC12181
OUTLINE DIMENSIONS
D SUFFIX PLASTIC PACKAGE CASE 751B-05 (SO-16) ISSUE J -A-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
16
9
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
DIM A B C D F G J K M P R
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MOTOROLA RF/IF DEVICE DATA
MC12181/D 9

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